TSMC has made significant progress in silicon photonics technology: 1.6T CPO has begun delivering samples and mass production is expected in the second half of 2025

 Recently, TSMC has made a major breakthrough in its silicon photonics strategy, successfully combining co-packaged optical components (CPO) technology with advanced semiconductor packaging technology, which will undoubtedly help it further develop in the fields of high-performance computing (HPC) and artificial intelligence (AI). The layout lays the foundation. TSMC cooperated with Broadcom and successfully developed the microring modulator (MRM), a key component of CPO technology, using 3nm process technology. This achievement provides the possibility to integrate CPO technology with ASIC chips for high-performance computing (HPC) or AI applications, achieving a major leap in computing tasks from electrical signal transmission to optical signals.

  As the demand for AI and machine learning (ML) increases dramatically, data centers face increasingly severe challenges: how to meet the demand for faster and more efficient computing within limited physical resources. This technological breakthrough of TSMC and the application of silicon photonics technology in data transmission are exactly the exploration and solution to this problem. By increasing the capacity and data transmission rate of optical fiber networks, silicon photonics technology not only promotes a jump in computing power, but also provides stronger support for cutting-edge technology fields such as AI and cloud computing.